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Customized micro-assembly machines

Whatever you need a fully automated production line or a stand alone lab platform, ISP System modular architecture offers bespoke and highly configurable die bonding and micro assembly solution to fully meet your need. Please find some of the already developed function blocks we can propose for your application:

<5 MICRO METER TILT CORRECTION

SUB-MICRONIC COMPONENT PLACEMENT

LASER SELECTIVE HEATING

Lense/ferule assembly

TIME/PRESSURE DISPENSING

WAFER COMPONENT SUPPLY

TAPE & REEL COMPONENT SUPPLY

DIE-BONDING

SOLDERING

GLUEING

Silver sintering

More information

We can provide you with fully customized micro-assembly machines. Please be free to contact us to find out what is the best configuration for your application.