ISP System has developed advanced features and capabilities to support specific Advanced Packaging Markets in the backend area. We enable customers to optimize the performance of their process in power module, power electronic, system in package, multi-chip module, as well as microelectronics and optoelectronics advanced packaging.

Our dedicated team of highly experienced, creative technical and manufacturing professionals have collected more than 10 years of knowledge in advanced micro assembly solutions. We can provide you with both standard and customized die attach systems based on leading-edge technology. The offering includes laser selective soldering, adhesive die bonding, as well as silver sintering.

Our team develops the systems with modern development tools focusing on: